Browse Prior Art Database

Double Capped Package for a Multichip Thin Film Module

IP.com Disclosure Number: IPCOM000110684D
Original Publication Date: 1992-Dec-01
Included in the Prior Art Database: 2005-Mar-25
Document File: 2 page(s) / 75K

Publishing Venue

IBM

Related People

Buchwalter, SL: AUTHOR [+4]

Abstract

Disclosed is a double-capped, environment-protected package for a surface-mount multichip thin-film module. The structure of the module consists of a substrate coated with multiple layers of thin dielectric films and metal-line circuits and having flexes on its periphery for interconnections to a printed-wiring board. The preferred material for the substrate is silicon. However, the packaging concept disclosed here can be adopted equally to other materials including but not limited to INVAR* and ceramics.

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This is the abbreviated version, containing approximately 53% of the total text.

Double Capped Package for a Multichip Thin Film Module

       Disclosed is a double-capped, environment-protected
package for a surface-mount multichip thin-film module.  The
structure of the module consists of a substrate coated with multiple
layers of thin dielectric films and metal-line circuits and having
flexes on its periphery for interconnections to a printed-wiring
board.  The preferred material for the substrate is silicon.
However, the packaging concept disclosed here can be adopted equally
to other materials including but not limited to INVAR* and ceramics.

      The cross-sectional view of a double-capped package for silicon
a thin-film module is shown in the figure. Semiconductor chips 11 are
bonded to the silicon module 18 via solder joints 12.  Layers of
metal wires on the surface of the silicon module 18 connect the
semiconductor chips 11 together as well as to the outside via the
leads on the flexes 17.  Connection wires on the module 18 and flexes
17 are not shown in the figure.  The module 18 is placed inside the
upper metal cap 14 with an elastomeric guard ring 15 on its
periphery.  A piece of thermally conductive material 13 between the
module 18 and upper cap 14 will enhance the thermal conductance
between them and dampen any mechanical vibrations.  On the back side
of each chip 11, there is a disc spring like thermal interface
material 19 to enhance the thermal conductance between chips 11 and
the lower metal cap 20.  The thermal int...