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Integral Spring Fingers for Grounding a Conductive Coated Surface of a Plastic Panel

IP.com Disclosure Number: IPCOM000110705D
Original Publication Date: 1992-Dec-01
Included in the Prior Art Database: 2005-Mar-25
Document File: 1 page(s) / 71K

Publishing Venue

IBM

Related People

Barina, RM: AUTHOR [+4]

Abstract

Disclosed is a method for electrically grounding a conductive surface of a thermoplastic panel, in which flexible spring fingers integral to the panel are held against an adjacent metal frame surface. Such a coated panel surface is typically useful in reducing the emission of electromagnetic energy from a computing system at radio frequency levels, which might otherwise interfere with the operation of adjacent equipment.

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Integral Spring Fingers for Grounding a Conductive Coated Surface of a Plastic Panel

      Disclosed is a method for electrically grounding a conductive
surface of a thermoplastic panel, in which flexible spring fingers
integral to the panel are held against an adjacent metal frame
surface.  Such a coated panel surface is typically useful in reducing
the emission of electromagnetic energy from a computing system at
radio frequency levels, which might otherwise interfere with the
operation of adjacent equipment.

      In the example of the figure, a thermoplastic panel 1 is
mounted adjacent to a system frame 2, constructed of a number of
stamped and formed metal pieces, including a shelf 3, which are
mutually tied to an electrical ground.  Panel 1 serves as a system
control panel bezel, with an exterior surface 4 providing part of the
outer surface of a computing system.

      After panel 1 is formed by a thermoplastic molding process, an
interior surface 5 of this panel is coated with a conductive
material, such as copper paint.  Panel 1 is provided with a number of
contact fingers 6, molded as integral parts thereof and coated with
conductive material.  Each contact finger 6 includes a flexible
portion 7 and a curved contact tip 8.  When panel 1 is assembled to
frame 2, contact tips 8 are held against an adjacent undersurface of
shelf 3, with each flexible portion 7 being deflected to maintain
contact pressure.

      Panel 1 is formed by a thermopla...