Browse Prior Art Database

Moldless Integrated Circuit Package

IP.com Disclosure Number: IPCOM000110710D
Original Publication Date: 1992-Dec-01
Included in the Prior Art Database: 2005-Mar-25
Document File: 1 page(s) / 43K

Publishing Venue

IBM

Related People

Froebel, FE: AUTHOR [+5]

Abstract

An simple integrated circuit package is described that requires no molded plastic or preformed enclosure parts. Conventional plastic molding techniques are replaced by a tape frame on the top surface of the lead frame that serves to hold an encapsulant in place to protect the wirebonds and the chip surface in the wiring channel.

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This is the abbreviated version, containing approximately 100% of the total text.

Moldless Integrated Circuit Package

      An simple integrated circuit package is described that requires
no molded plastic or preformed enclosure parts.  Conventional plastic
molding techniques are replaced by a tape frame on the top surface of
the lead frame that serves to hold an encapsulant in place to protect
the wirebonds and the chip surface in the wiring channel.

      Fabrication consists of the following steps.  Completed
packages are shown below for two types of lead forming.
      1.  The chip is attached and wirebonded to the lead frame using
conventional procedures, including chip attach tape.
      2.  A tape frame is applied to the periphery of the top side of
the lead frame, as shown, to provide a flow control channel for an
encapsulant, and to provide mechanical support for the leads.
      3.  A low modulus of elasticity encapsulant is applied within
the tape frame as shown.  The encapsulant provides mechanical
protection for the wires and serves as a semi-hermetic seal for the
exposed chip area in the wiring channel.
      4.  The leads from the lead frame are trimmed and formed, as
shown.  Two commonly used lead configurations are shown.

      Disclosed anonymously.