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Browse Prior Art Database

Chip Thermal Monitoring During Chip Removal

IP.com Disclosure Number: IPCOM000110721D
Original Publication Date: 1992-Dec-01
Included in the Prior Art Database: 2005-Mar-25
Document File: 1 page(s) / 42K

Publishing Venue

IBM

Related People

Pierson, RL: AUTHOR [+2]

Abstract

During chip removal, the temperature of the chip can be monitored by electrically testing the chip's OCTS (on chip thermal sensor). This avoids the current practice of open-loop chip heating which is subject to overheating the chip during the removal process. (Image Omitted)

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 100% of the total text.

Chip Thermal Monitoring During Chip Removal

      During chip removal, the temperature of the chip can be
monitored by electrically testing the chip's OCTS (on chip thermal
sensor).  This avoids the current practice of open-loop chip heating
which is subject to overheating the chip during the removal process.

                            (Image Omitted)

      Each chip (2) has an OCTS diode (3), available thru the chip
I/O (8), wired in a matrix (6) within the substrate (7) and
accessible thru the substrate pins (4).  When a chip is to be
removed, for EC or repair, the substrate pins for that chip are
contacted for connection of tester (5) that will test the diode
characteristics for resolving the chip's temperature.  The chip's
temperature is monitored continuously as the heating source within
vacuum probe (1) applies heat to the heating source within vacuum
probe (1) applies heat to the chip.  This continuous monitor allows a
controlled ramping and control of the chip temperature, as well as a
continuous closed-loop control of the process.  When the chip's upper
temperature limit is reached, suitable for the chip's solder
connections (8) to become liquidous, the chip heating source is
turned off, and vacuum applied thru the vacuum probe for removing the
chip from the substrate.

      Disclosed anonymously.