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Utilize Micro-encapsulated Conductors to Provide a Tamper Awareness Enclosure for Sensitive Circuits

IP.com Disclosure Number: IPCOM000110723D
Original Publication Date: 1992-Dec-01
Included in the Prior Art Database: 2005-Mar-25
Document File: 1 page(s) / 41K

Publishing Venue

IBM

Related People

Lifshey, IH: AUTHOR

Abstract

Disclosed is a method of fabricating a tamper awareness enclosure for secure data components using micro-encapsulated conductive material.

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 100% of the total text.

Utilize Micro-encapsulated Conductors to Provide a Tamper Awareness Enclosure for Sensitive Circuits

      Disclosed is a method of fabricating a tamper awareness
enclosure for secure data components using micro-encapsulated
conductive material.

      The sensitive components are protected by a conductive
(metallic) housing.  The inside of the housing is coated with
material containing the conductive micro-encapsulated material with
an outer coating of non-conductive material.  An inner conductive
shell is placed inside of the outer housing forming a sandwich with
micro-encapsulated material in the middle (see Fig. 1).

      Under normal conditions (no tamper) the outer and inner shell
are electrically isolated.  If a tamper occurs (attempt to penetrate
the enclosure with a metallic or non-metallic probe, drill, knife,
etc.) the micro-encapsulated conductive material is released causing
the outer and inner shell to be in electrical contact generating a
tamper awareness signal (see Fig. 2).

      Disclosed anonymously.