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Browse Prior Art Database

Repair of Pad to Ball (or Column) on Solder Ball Column Pad on Via Opens

IP.com Disclosure Number: IPCOM000110730D
Original Publication Date: 1992-Dec-01
Included in the Prior Art Database: 2005-Mar-25
Document File: 1 page(s) / 25K

Publishing Venue

IBM

Related People

Isaacs, PD: AUTHOR [+2]

Abstract

A circuit open repair method that can be used with land grid array modules in a pad on via application is disclosed.

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 100% of the total text.

Repair of Pad to Ball (or Column) on Solder Ball Column Pad on Via Opens

      A circuit open repair method that can be used with land grid
array modules in a pad on via application is disclosed.

      To repair opens on a land grid array in a pad on via
application, use the following process:
o    Heat the printed circuit board to a temperature somewhat below
solder reflow temperature.
o    Tin the plated through hole (PTH) with flux and solder.
o    Heat the PTH to reflow temperature using a soldering iron.
o    With the solder in the PTH reflowed, insert the repair wire into
the PTH applying the solder iron to the end of the wire as well until
a joint has formed between the solder bump and the repair wire.
o    Remove the solder iron from the joint.
o    Clean as appropriate.

      Disclosed anonymously.