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Browse Prior Art Database

Bottom Surface Metallurgy for Pad on Pad Connector

IP.com Disclosure Number: IPCOM000110738D
Original Publication Date: 1992-Dec-01
Included in the Prior Art Database: 2005-Mar-25
Document File: 1 page(s) / 47K

Publishing Venue

IBM

Related People

Beaman, B: AUTHOR [+5]

Abstract

A multilayer thin film metallurgy is designed to withstand the sliding and wear generated from an interposer connector, which is sandwiched between a substrate and board. To ensure that a reliable contact with low contact resistance can be achieved for a prolonged time, the proposed metallurgy consists of three layers: an adhesion layer, a wear/oxidation resistance layer and a gold layer. The adhesion layer uses one of the refractory metals from such element of Cr, Zr, Ta, Ti, V, Nb, or Hf. For the second layer, the metals that have demonstrated both good wear and oxidation resistance are those from the platinum group, which includes Platinum, Palladium, Iridium, Rhenium, Rhodium and Ruthenium.

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Bottom Surface Metallurgy for Pad on Pad Connector

      A multilayer thin film metallurgy is designed to withstand the
sliding and wear generated from an interposer connector, which is
sandwiched between a substrate and board.  To ensure that a reliable
contact with low contact resistance can be achieved for a prolonged
time, the proposed metallurgy consists of three layers: an adhesion
layer, a wear/oxidation resistance layer and a gold layer.  The
adhesion layer uses one of the refractory metals from such element of
Cr, Zr, Ta, Ti, V, Nb, or Hf.  For the second layer, the metals that
have demonstrated both good wear and oxidation resistance are those
from the platinum group, which includes Platinum, Palladium, Iridium,
Rhenium, Rhodium and Ruthenium.  To further ensure good wear and
oxidation resistance the Pt, Pd, Ir, Re, Rh or Ru can be alloyed with
Au by co-evaporation, co-sputtering or co-plating with the Au
composition ranging from 5 to 60 percent.  As an example, the Au-Pt
alloy has been known to have the highest oxidation resistance at
elevated operating temperatures, along with good wear resistance
property and good contact resistance.  The top layer (third layer)
should be a gold layer, which can be either a soft or hard gold
layer.  The selection of its hardness depends on the hardness of the
Au surface on the mating connector.  The three-layer thin film
structure is shown below.

      Adhesion       Wear/Oxidation       Contact
  ...