Browse Prior Art Database

Self Aligned Adhesive for Semiconductor Chip Stack

IP.com Disclosure Number: IPCOM000110741D
Original Publication Date: 1992-Dec-01
Included in the Prior Art Database: 2005-Mar-25
Document File: 1 page(s) / 34K

Publishing Venue

IBM

Related People

Coteus, PW: AUTHOR [+4]

Abstract

Disclosed is a self-aligned adhesive structure for stacking chips. In the preferred embodiment, a liquid adhesive is spun onto the back of the semiconductor wafer before the wafer is diced. The thickness may be controlled by varying the spinning speed. It may be increased by means of multiple applications. The applied adhesive is partially cured to a solid tack-free state. The wafer is then diced and individual chips are selected and aligned for the chip stack. The stack assembly is completed through the application of an elevated temperature or pressure or a combination of the two. Since the dicing operation cuts the chips and adhesive layer to the same dimensions, there will be 100 percent coverage of the backs of the chips.

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This is the abbreviated version, containing approximately 100% of the total text.

Self Aligned Adhesive for Semiconductor Chip Stack

      Disclosed is a self-aligned adhesive structure for stacking
chips.  In the preferred embodiment, a liquid adhesive is spun onto
the back of the semiconductor wafer before the wafer is diced.  The
thickness may be controlled by varying the spinning speed.  It may be
increased by means of multiple applications.  The applied adhesive is
partially cured to a solid tack-free state.  The wafer is then diced
and individual chips are selected and aligned for the chip stack.
The stack assembly is completed through the application of an
elevated temperature or pressure or a combination of the two.  Since
the dicing operation cuts the chips and adhesive layer to the same
dimensions, there will be 100 percent coverage of the backs of the
chips.

      Alternatively, the adhesive may be procured as a partially
cured dry film.  The film is laminated to the wafer.  It is cured
sufficiently to cause it to adhere, but it is not completely cured.
The chips are diced and assembled as described above.

      Disclosed anonymously.