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Optoelectronic Assembly Utilizing Liquid Crystal Polymer

IP.com Disclosure Number: IPCOM000110858D
Original Publication Date: 1994-Jan-01
Included in the Prior Art Database: 2005-Mar-26
Document File: 2 page(s) / 57K

Publishing Venue

IBM

Related People

Bross, A: AUTHOR [+3]

Abstract

Disclosed is a low cost Optoelectronic Assembly that is built using hardware that is injection molded out of Liquid Crystal Polymer (LCP). The design is low cost through reductions in unit hours, cycle time, hardware costs and processing steps. The design provides full package EMI/ESD hardening and a flexible choice of pin I/O patterns.

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Optoelectronic Assembly Utilizing Liquid Crystal Polymer

      Disclosed is a low cost Optoelectronic Assembly that is built
using hardware that is injection molded out of Liquid Crystal Polymer
(LCP).  The design is low cost through reductions in unit hours,
cycle time, hardware costs and processing steps.  The design provides
full package EMI/ESD hardening and a flexible choice of pin I/O
patterns.

      LCP formulations pose ideal qualities for use in optoelectronic
module packaging.  Primarily, the material is capable of withstanding
temperature exposures in excess of 350 degrees Celsius, without
distortion or degradation of physical properties.  LCP can thus be
circuitized and used as a substrate carrier for C-4 attached devices.
Fillers are engineered to optimize dielectric, thermal and strength
characteristics.

This assembly has the following features (Figure):

1.  The module housing is molded out of LCP.  The housing is designed
    with separated transmitter and receiver sections.

2.  The module pins are included in the molding operation of the
    housing.  By simply exchanging sections of the mold tooling, any
    variety of pin patterns and pin lengths can be produced.

3.  The transmitter and receiver sections of the housing are
    circuitized and isolated from each other.  IC's and discrete
    components are attached to the LCP housing using eutectic solder.

4.  The module lid is molded out of LCP.  The lid is designed to b...