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Bottom-Brazed Component Form Nest

IP.com Disclosure Number: IPCOM000110866D
Original Publication Date: 1994-Jan-01
Included in the Prior Art Database: 2005-Mar-26
Document File: 2 page(s) / 28K

Publishing Venue

IBM

Related People

Caceres, J: AUTHOR [+4]

Abstract

Disclosed is a form nest for bottom-brazed components which do not have a standoff molded to the underside of the device. The form nest is inserted into an adjustable form die which forms and cuts the device leads to a specified dimension in preparation for assembly on a circuit card.

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This is the abbreviated version, containing approximately 100% of the total text.

Bottom-Brazed Component Form Nest

      Disclosed is a form nest for bottom-brazed components which do
not have a standoff molded to the underside of the device.  The form
nest is inserted into an adjustable form die which forms and cuts the
device leads to a specified dimension in preparation for assembly on
a circuit card.

      The form nest employs 4 centering shims (Figure) in a location
scheme that locates off of the component body above the leads.  The
shims are fastened to a standard form nest and locate the device by
constraining movement along the axis of the device leads.  The
resultant formed part is centered within the formed leads without
relying on a molded standoff on the underside of the component body
for location.