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Bottom-Brazed Component Ceramic Spacer

IP.com Disclosure Number: IPCOM000110881D
Original Publication Date: 1994-Jan-01
Included in the Prior Art Database: 2005-Mar-26
Document File: 2 page(s) / 25K

Publishing Venue

IBM

Related People

Caceres, J: AUTHOR [+4]

Abstract

Disclosed is ceramic spacer specifically designed for use on the IBM 256K SRAM. This bottom-brazed component is configured to receive decoupling capacitors on the bottom of the substrate, yet the device is often used without these chip capacitors. A ceramic spacer has been developed for applications not requiring the decoupling capacitors.

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Bottom-Brazed Component Ceramic Spacer

      Disclosed is ceramic spacer specifically designed for use on
the IBM 256K SRAM.  This bottom-brazed component is configured to
receive decoupling capacitors on the bottom of the substrate, yet the
device is often used without these chip capacitors.  A ceramic spacer
has been developed for applications not requiring the decoupling
capacitors.

      The .45"x.64"x.040-.047" alumina ceramic spacer is bonded to
the bottom of the substrate (Figure).  User of the spacer redefines
the bottom surface of the component so that it is physically
identical to a bottom-brazed component with a molded standoff.  The
device leads can now be formed with the vertical lead form distance
required to meet solder joint reliability requirements, while keeping
the distance from the bottom of the component to the printed wiring
board surface at a minimum.