Browse Prior Art Database

Solder Thief Control of Excess Solder at Solder Fountain Processes

IP.com Disclosure Number: IPCOM000110886D
Original Publication Date: 1994-Jan-01
Included in the Prior Art Database: 2005-Mar-26
Document File: 2 page(s) / 31K

Publishing Venue

IBM

Related People

Boll, SE: AUTHOR [+2]

Abstract

Elimination of excessive solder conditions that occur at fountain solder dip processes can be achieved with the use of a solder thief tool.

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This is the abbreviated version, containing approximately 100% of the total text.

Solder Thief Control of Excess Solder at Solder Fountain Processes

      Elimination of excessive solder conditions that occur at
fountain solder dip processes can be achieved with the use of a
solder thief tool.

      A typical solder thief application is shown in the Figure.  The
solder thief tool 1 has a solderable surface 2 and an unsolderable
surface 3.  The tool is positioned on the test point block 4 and in
close proximity to the test point pins 6 that are to be soldered.
The test point block 4 is assembled within the printed wiring board 7
and frame 8 prior to soldering.

      During the soldering operation, the assembly is lowered into
the molten solder wave 10 such that the plated through hole surface
lands 9 are in contact with the wave.  Streamlines 11 show the
direction of the solder flow.  The solder wets the lands 9 and
solders pins 6 into the plated through holes of the board.  When the
assembly is removed in an upward direction 5, the solder thief's
solderable surface 2 acts to pull excess solder from pins 6 and lands
9, which eliminates excess solder and bridging conditions.