Browse Prior Art Database

Low Cost Plastic Optoelectronic Assembly

IP.com Disclosure Number: IPCOM000110902D
Original Publication Date: 1994-Jan-01
Included in the Prior Art Database: 2005-Mar-26
Document File: 2 page(s) / 44K

Publishing Venue

IBM

Related People

Nolan, RG: AUTHOR

Abstract

Disclosed is a Plastic Optoelectronic Assembly, which, through the use of ESD-hardened pre-amp circuitry, reduces product cost through reductions in: unit hours, cycle time, hardware costs and processing steps.

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Low Cost Plastic Optoelectronic Assembly

      Disclosed is a Plastic Optoelectronic Assembly, which, through
the use of ESD-hardened pre-amp circuitry, reduces product cost
through reductions in: unit hours, cycle time, hardware costs and
processing steps.

      The plastic design (Figure) provides no package ESD protection
except that which is inherent in the pre-amp circuitry function.

This assembly has the following features:

1.  The Optical Sub-Assemblies (OSAs) are press-fit into a one piece
    plastic body, providing accurate alignment for duplex connector
    pluggability.  The OSAs include a shoulder that seats against the
    plastic body to absorb all normal plugging loads.

2.  The leads of the OSAs are pre-formed and cut to length.  The
    leads exit the plastic body through holes that accurately
    position the leads for attachment to the substrate.

3.  The substrate is press-fit into the two arms of the plastic body.
    The arms are designed to self-center the substrate in relation to
    the leads and the card-mounting features on the plastic body.

4.  A topseal epoxy is dispensed around the IC's and the leads for
    protection and strengthening of their connections to the
    substrate.

5.  A UV-cure epoxy is dispensed over the entire surface of the
    substrate to hermetically seal the circuitry.

6.  If further ESD hardening, or thermal dissipation, is required,
    metal grounding clips/covers can be ...