Browse Prior Art Database

Fine Line Solder Bonding

IP.com Disclosure Number: IPCOM000110920D
Original Publication Date: 1994-Jan-01
Included in the Prior Art Database: 2005-Mar-26
Document File: 2 page(s) / 38K

Publishing Venue

IBM

Related People

Walston, K: AUTHOR [+2]

Abstract

This technique describes a method to bond a lead of a conductor and/or conductors on a cable to a pad and/or pads on a substrate. Typically, this is accomplished by using wire bond or solder ball reflow techniques. However, both of these techniques are limited to the physical geometries of the wire bond and the solder ball reflow.

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Fine Line Solder Bonding

      This technique describes a method to bond a lead of a conductor
and/or conductors on a cable to a pad and/or pads on a substrate.
Typically, this is accomplished by using wire bond or solder ball
reflow techniques.  However, both of these techniques are limited to
the physical geometries of the wire bond and the solder ball reflow.

      Fine line solder bonding is accomplished by electroplating
tin/lead solder to the conductor and/or conductors of the cable.  The
tin/lead electroplating is a conventional plating process commonly
used in fine line gold-plating baths.  Fine lines are defined as
0.001 inch conductor width and spaces or smaller.  The tin/lead
plating thickness and uniformity is controlled in micro inches.  The
plating is then reflowed using conventional reflow techniques.

      Flex circuits (custom cables) can be manufactured to 0.001 inch
conductor width and space.  The exposed conductors of the flex
circuit are then thoroughly cleaned prior to plating.  The exposed
conductors of the flex circuit are then tin/lead plated.  The flex
circuit is then ready for assembly to the substrate.

      The assembly process, the flex circuit to the substrate,
requires precision optical alignment equipment.  Once aligned, the
tin/lead is reflowed using conventional techniques.  A mechanical
strain relief is used to protect the fragile flex circuit to
substrate interconnection.

      Fine line solder bonding a...