Browse Prior Art Database

Module Connection

IP.com Disclosure Number: IPCOM000110967D
Original Publication Date: 1994-Jan-01
Included in the Prior Art Database: 2005-Mar-26
Document File: 2 page(s) / 52K

Publishing Venue

IBM

Related People

Gruber, H: AUTHOR [+4]

Abstract

This article proposes a compliant pin combined with pad-on-pad module connection.

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 67% of the total text.

Module Connection

      This article proposes a compliant pin combined with pad-on-pad
module connection.

      All module power pins are made compliant pins.  All module
signal pins are made pads-for-pad on pad connections.  The package
holding the module has plated-through holes at the module compliant
pin locations and pads for the pad-on-pad connection.  The compliant
pins provide the force that holds the pad-on-pad connections
together.  They also provide the low resistance interface to supply
the power to the module.  The pad-on-pad connection may be made with
dendrites.

      Modules are soldered into cards by the pin inhole process or by
the SMT process.  Special fixtures are required to temporally mount
the modules for system debug.  The signal and power planes have to be
particularly designed for this solder operation.

The proposed connection (Figure) has several advantages:

      The compliant pin combined with pad-on-pad module to card
assembly can be mechanically separated, and for debug (and with test
cards with special plated-through holes that accept several compliant
pin pluggings) it could be done several times.

      The power connections are cold-welded low-resistance
connections due to the pressure of the compliant pins against the
side walls of the plated-through holes.

      No connector has to be added in between the module and card.
Therefore, a better match of the electrical connection
characteristics during debu...