Browse Prior Art Database

Advanced Component Tinning Process

IP.com Disclosure Number: IPCOM000111023D
Original Publication Date: 1994-Feb-01
Included in the Prior Art Database: 2005-Mar-26
Document File: 2 page(s) / 24K

Publishing Venue

IBM

Related People

Boll, SE: AUTHOR [+3]

Abstract

Polyoxyglycol flux blanket (1) is floated on the surface of flowing molten solder (2) which is contained by specialized solder pot nozzle (3). Component leads (4) of component (5) are dipped through polyoxyglycol flux blanket (1) into molten solder (2), dwelled and withdrawn to solder coat the component leads (4). This process eliminates the need for a separate component lead fluxing operation.

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Advanced Component Tinning Process

      Polyoxyglycol flux blanket (1) is floated on the surface of
flowing molten solder (2) which is contained by specialized solder
pot nozzle (3).  Component leads (4) of component (5) are dipped
through polyoxyglycol flux blanket (1) into molten solder (2),
dwelled and withdrawn to solder coat the component leads (4).  This
process eliminates the need for a separate component lead fluxing
operation.