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Browse Prior Art Database

Inner Lead Bond Attach Fixture

IP.com Disclosure Number: IPCOM000111030D
Original Publication Date: 1994-Feb-01
Included in the Prior Art Database: 2005-Mar-26
Document File: 2 page(s) / 43K

Publishing Venue

IBM

Related People

Horton, RR: AUTHOR [+3]

Abstract

The inner lead bond attach fixture produces bias heat for accurate placement of Flex Tape fingers onto substrate solder pads for the solder attach process.

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This is the abbreviated version, containing approximately 100% of the total text.

Inner Lead Bond Attach Fixture

      The inner lead bond attach fixture produces bias heat for
accurate placement of Flex Tape fingers onto substrate solder pads
for the solder attach process.

      In the Figure, silicon substrate is placed manually onto the
cavitated fixture nest (1-2).  Formed flex tapes (3), are then
manually placed on all four corners, over the flex tape upper and
lower positioning pins (4-5).  Vacuum inlets are activated to
eliminate any flex tape effect and to secures all flex tapes in
position, (6).  The jaw is lowered into the nest, the contour of the
jaw follows the flex tape form, then it is secured with locking
hardware (7-8).  The purpose of the jaw is to insure that all four
flex tapes are still during substrate lift.

      Compressed nitrogen is introduced through the four inlets and
to built in air lift pistons (9).  This introduces all substrate
solder pads to the flex tape fingers.  Heater block (10) produces
proper bias heat necessary for the bonding process.  Hot nitrogen is
then introduced to the flex tapes and to the substrate solder pads
producing a solder bond.