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Method of Making a Lower-Cost Low-Dielectric Constant Material

IP.com Disclosure Number: IPCOM000111033D
Original Publication Date: 1994-Feb-01
Included in the Prior Art Database: 2005-Mar-26
Document File: 2 page(s) / 64K

Publishing Venue

IBM

Related People

Chapin, FW: AUTHOR [+3]

Abstract

Disclosed is a method of making a lower-cost low-dielectric constant material that may be constructed by punching a series of holes on a regular pattern in a layer of relatively inexpensive dielectric material. The replacement of most of the dielectric material with air lowers the effective dielectric constant of the overall structure.

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Method of Making a Lower-Cost Low-Dielectric Constant Material

      Disclosed is a method of making a lower-cost low-dielectric
constant material that may be constructed by punching a series of
holes on a regular pattern in a layer of relatively inexpensive
dielectric material.  The replacement of most of the dielectric
material with air lowers the effective dielectric constant of the
overall structure.

      Fig. 1 shows a top view of the punched dielectric layer.  Fig.
2 shows an exploded cross-sectional view of the overall structure
prior to assembly using the disclosed method.  Fig. 3 shows a
cross-sectional view of the overall structure after assembly.

      The following example demonstrates how this concept may be used
to construct a lower-cost low-dielectric material:

1.  Build a standard, single-sided (no ground plane) printed circuit
    layer.  The thickness of the base dielectric layer is not
    critical since it is used only as a carrier for the printed
    circuit lines.

2.  Punch a series of holes in a layer of dielectric material (Fig.
    1).

3.  Bond a layer of copper to the top side of the protective
    dielectric layer.

4.  Bond the printed circuit layer to the structures from steps 2 and
    3 (Fig. 2).

5.  Etch away any portions of the protective dielectric layer to
    expose copper wherever required.

6.  Complete any finishing work (platings, protective dielectric
    layers, etc.) that is needed on...