Browse Prior Art Database

Bubble Flux

IP.com Disclosure Number: IPCOM000111104D
Original Publication Date: 1994-Feb-01
Included in the Prior Art Database: 2005-Mar-26
Document File: 2 page(s) / 32K

Publishing Venue

IBM

Related People

Phillips, RB: AUTHOR [+2]

Abstract

The bubble flux apparatus its produces a thin film of flux ready to apply unto a chip C4 pads, then flux wetted chip is placed on its respective position on a substrate, the assembled chip and substrate are now ready for joining process.

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Bubble Flux

      The bubble flux apparatus its produces a thin film of flux
ready to apply unto a chip C4 pads, then flux wetted chip is placed
on its respective position on a substrate, the assembled chip and
substrate are now ready for joining process.

      This process reduces cleaning, over abundance of flux, and chip
float during furnace C4 solder joining.  It promotes accurate and
consistence flux thickness applied unto chips.

      In the Figure, (1) the vacuum probe is essential to hold firmly
the chip prior to flux application.  (2) Vat & Flux is the reservoir
that stores the flux.  (3) The wire loop is a formed circular music
wire, held mechanically on the (4) "Z" motion.  When wire loop (3) is
immersed in the flux (2) and then "Z" motion (4) travels vertically
it will form a taffy pull (5), and produces a thin flux membrane (6)
under the chip (7), then flux will layer itself under the chip C4
pads, a thin wetness of flux is produced all around and each C4 pad.