Browse Prior Art Database

Lid/Cap Removal Tool and Process

IP.com Disclosure Number: IPCOM000111120D
Original Publication Date: 1994-Feb-01
Included in the Prior Art Database: 2005-Mar-26
Document File: 4 page(s) / 67K

Publishing Venue

IBM

Related People

Burton, DW: AUTHOR [+4]

Abstract

The lid/cap removal tool separates the lid/cap from the module. The separation occurs as soon as the solder, the lid module catalyst agent, is in a soft pastelike state. The solder stays on the module seal band and does not flow over the metalized parts of the module.

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Lid/Cap Removal Tool and Process

      The lid/cap removal tool separates the lid/cap from the module.
The separation occurs as soon as the solder, the lid module catalyst
agent, is in a soft pastelike state.  The solder stays on the module
seal band and does not flow over the metalized parts of the module.

      In Fig. 1, the inner skirt, 1, is a fabricated part with a
vacuum cavity to hold the module securely by the lid.  Fig. 2 shows
the outer skirt, 2, is also a square fabricated part that has four
stainless steel pins, 3, to prevent any aluminum residue on the
ceramic module and promotes parallelism.  Fig. 3 shows the guides, 4,
insures frictionless movement between the inner and outer skirts,
1-2.

      In Fig. 4, the head assembly is activated through four
compression spring assemblies, 5, which are secured through four
shoulder screws, 6.

      The heat is produced through a lamp heater where the
temperature is monitored and controlled via a controller and
thermocouple.  As an assembly, shown in Fig. 5, the selected springs
ensures relative gentle separation of the module and lid so as to
prevent damage of the module.