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Browse Prior Art Database

Poly(amic alkyl ester-co-siloxane) Copolymers for Electronic Packaging

IP.com Disclosure Number: IPCOM000111147D
Original Publication Date: 1994-Feb-01
Included in the Prior Art Database: 2005-Mar-26
Document File: 2 page(s) / 42K

Publishing Venue

IBM

Related People

Hedrick, JL: AUTHOR [+5]

Abstract

The fabrication of multilevel polyimide-metal structures used in chip BEOL wiring or module thin film packaging generally involve oxygen RIE processing to pattern polyimide films. The use of a permanent, buried oxygen RIE barrier simplifies the basic process of building these multilevel structures. The polyimide-siloxane copolymers which have been reported in the scientific and patent literature [1,2] have too many drawbacks to be considered for this application: inadequate silicon content for effective barrier to oxygen RIE, poor thermal stability compared to PMDA-ODA, and poor mechanical properties and lower glass transition temperatures than preferred.

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Poly(amic alkyl ester-co-siloxane) Copolymers for Electronic Packaging

      The fabrication of multilevel polyimide-metal structures used
in chip BEOL wiring or module thin film packaging generally involve
oxygen RIE processing to pattern polyimide films.  The use of a
permanent, buried oxygen RIE barrier simplifies the basic process of
building these multilevel structures.  The polyimide-siloxane
copolymers which have been reported in the scientific and patent
literature [1,2] have too many drawbacks to be considered for this
application: inadequate silicon content for effective barrier to
oxygen RIE, poor thermal stability compared to PMDA-ODA, and poor
mechanical properties and lower glass transition temperatures than
preferred.

      The preparation of polyimides via their poly(amic ester)
precursors has been studied extensively in this laboratory [3].  By
extending the procedure  for the synthesis of semi-rigid or rigid-rod
poly(amic esters) such as PMDA-ODA, BPDA-ODA and BPDA-PDA to
incorporate aromatic amine terminated siloxane oligomers, the
poly(imide-co-siloxane) copolymers obtained have many of the desired
properties for a buried oxygen RIE material.  The copolymer obtained
have many of the desired properties for a buried oxygen RIE material.
The copolymer exhibits a high glass transition temperature
(>350ºC) and outstanding mechanical properties (modulus>350
kpsi and strain at break >  30%) associated with the polyimide block.
Secondly, it allow...