Browse Prior Art Database

Electro-magnetic Shielding for High-Frequency Applications

IP.com Disclosure Number: IPCOM000111159D
Original Publication Date: 1994-Feb-01
Included in the Prior Art Database: 2005-Mar-26
Document File: 2 page(s) / 35K

Publishing Venue

IBM

Related People

Davis, TL: AUTHOR [+3]

Abstract

Traditional means to reduce EMC emissions have been the use of devices that reduce the various harmonics on the system's planar. Another common method is to use metallic tape to provide the necessary grounding around the emission source.

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This is the abbreviated version, containing approximately 100% of the total text.

Electro-magnetic Shielding for High-Frequency Applications

      Traditional means to reduce EMC emissions have been the use of
devices that reduce the various harmonics on the system's planar.
Another common method is to use metallic tape to provide the
necessary grounding around the emission source.

      On workstation computers, fast clock rates can create several
harmonics that tended to radiate through various connectors.  The
most difficult to isolate are typically around the traditional mouse,
keyboard, and tablet connectors.  Additional decoupling can fail to
significantly reduce the high frequency harmonics around these
connectors.  This is related to high frequency/short wavelengths and
proximity of available decoupling components.

      The disclosed concept, shown in Figs. A and B, provides a cost
effective solution for reducing the EMC profile for the machine.  The
tabs that insert into the bottom of the connector, part A, along with
those positioned directly below, part B, provide the grounding for
each connector.  This approach allows for dedundant contacts on the
connectors to insure electrical continuity.  Also, part C provides
the grounding to the system's chassis.  Also, the shield has proved
to be an inexpensive manufacturable solution.