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Platingless Inner Lead Bonding Lead Tape Automated Bonding Tape

IP.com Disclosure Number: IPCOM000111258D
Original Publication Date: 1994-Feb-01
Included in the Prior Art Database: 2005-Mar-26
Document File: 2 page(s) / 37K

Publishing Venue

IBM

Related People

Ohmura, E: AUTHOR

Abstract

Disclosed is a TAB (Tape Automated Bonding) tape without ILB (Inner Lead Bonding) area plating (ILB partially Cu exposed) for the purpose of the prevention of ILB solder transition from tape joint side to rear side which causes ILB defects such as Bridged-land, Lead space off, Poor solder joint fillet etc.

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Platingless Inner Lead Bonding Lead Tape Automated Bonding Tape

      Disclosed is a TAB (Tape Automated Bonding) tape without ILB
(Inner Lead Bonding) area plating (ILB partially Cu exposed) for the
purpose of the prevention of ILB solder transition from tape joint
side to rear side which causes ILB defects such as Bridged-land, Lead
space off, Poor solder joint fillet etc.

      Fig. 1 shows an example of such plotingless ILB lead TAB tape.
Partially Cu exposed ILB lead 1 can get adequate solder wettability
which prevents TAB ILB from causing solder transition 4 out of the
joint area 1 and makes highly reliable and stable solder joint fillet
2.

      Current Tin, Au or solder plating ILB 3 tends to make excessive
solder wetting on ILB lead area resulting into Solder transition 4
out of joint area from the joint side to the rear side 5, as shown in
Fig. 2.