Browse Prior Art Database

Field Replaceable Optical Link Card

IP.com Disclosure Number: IPCOM000111277D
Original Publication Date: 1994-Feb-01
Included in the Prior Art Database: 2005-Mar-26
Document File: 2 page(s) / 51K

Publishing Venue

IBM

Related People

Block, TR: AUTHOR [+8]

Abstract

A method to provide a highly reliable and manufacturable optical link card with field installation and upgrade capabilities is disclosed. The packaging design allows for top/bottom and side-to-side stacking in tight geometries.

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 100% of the total text.

Field Replaceable Optical Link Card

      A method to provide a highly reliable and manufacturable
optical link card with field installation and upgrade capabilities is
disclosed.  The packaging design allows for top/bottom and
side-to-side stacking in tight geometries.

      A basic form factor was developed around available high density
electrical and optical connector technologies.

      A cover set was designed to enclose all subassemblies and
provides the EMI/EMC protection, handling ruggedness, and optical and
electrical connector guidance and keying features.  The cover sets
work in conjunction with external guiding features to provide
latching and mechanical advantage requirements in the customer access
area.

      An optical subassembly is comprised of a two-piece retainer set
which holds the optical parts and contains features of the optical
connectors.  Electrical signals are exchanged with the main
electronics assembly through the impedance controlled flexible cable.
Thermal isolation between the optics and electronics is established
by the high thermal impedance characteristics of the flexible cable
medium.  Additionally, the flex cable and card retainers are designed
to allow mechanical float between the optical connectors and the
electrical connectors to minimize mechanical strain on parts.

      Figs. 1, 2, and 3 show internal and external views of the card
package including the optics subassemby and latching mechanisms.