Dismiss
InnovationQ will be updated on Sunday, Oct. 22, from 10am ET - noon. You may experience brief service interruptions during that time.
Browse Prior Art Database

Power Distribution Connector

IP.com Disclosure Number: IPCOM000111371D
Original Publication Date: 1994-Feb-01
Included in the Prior Art Database: 2005-Mar-26
Document File: 4 page(s) / 110K

Publishing Venue

IBM

Related People

Myers, KH: AUTHOR [+3]

Abstract

The need exists for a simpler and more expedient method for connecting and distributing power to main system memory or logic circuit boards. The current method for distributing power to highend circuit boards is with the use of a large laminar buss bar which is terminated to the circuit board via large number of solder tabs. The power distribution laminar buss tabs that are currently soldered to the system circuit board encounter a high degree of damage due to shipping and handling. The damage encountered, results in a large number of system circuit boards requiring board rework to repair cracked buss bar solder joints as a result of the shipping and handling problem.

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 52% of the total text.

Power Distribution Connector

      The need exists for a simpler and more expedient method for
connecting and distributing power to main system memory or logic
circuit boards.  The current method for distributing power to highend
circuit boards is with the use of a large laminar buss bar which is
terminated to the circuit board via large number of solder tabs.  The
power distribution laminar buss tabs that are currently soldered to
the system circuit board encounter a high degree of damage due to
shipping and handling.  The damage encountered, results in a large
number of system circuit boards requiring board rework to repair
cracked buss bar solder joints as a result of the shipping and
handling problem.

      Disclosed is a multiple voltage distribution connector for
intermediate to high end system electronic packages.  The six claims
features:

    a.  Supports power feed directly from power supplies or via
        distribution buses

    b.  Adaptable to both logic and memory board designs

    c.  Board power interface area minimized

    d.  Supports peripheral power distribution to the board assembly,
        thus affording the following:

            -   Minimizes component to component pitch

            -   Eliminates signal line jogging (line pitch reduction)
                wire component wiring

            -   Supports larger PTH's for current distribution

    e.  Support removal of the laminar bus from the board resulting
        in the following:

            -   Board assembly cost reduction

            -   Distribution bus on gate, therefore transparent to
                board failure, E/C or machine upgrading

            -   Reduction in board assembly weight

            -   Increase in shock and vibration threshold

            -   Greatly minimize or eliminate former bus damage due
                to board assembly handling

    f.  Reliability improved at board power distribution interface.
        Square in PTH affords better solder hold fill and can be
        inspected by conventional methods.

      A method and implementation is described to permit large system
boards to be connected directly to main system power source.  The
method described for transporting power allows even current
distribution around the periphery of the system board.  The method
also allows system boards to be quickly disconnected from the system
frame.  This method will eliminate the need for a laminar buss power
distrib...