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Browse Prior Art Database

Internal Components on Printed Circuit Boards by Hybrid Circuit Technique

IP.com Disclosure Number: IPCOM000111395D
Original Publication Date: 1994-Feb-01
Included in the Prior Art Database: 2005-Mar-26
Document File: 2 page(s) / 79K

Publishing Venue

IBM

Related People

Lees, S: AUTHOR [+4]

Abstract

Disclosed is a technique for inbedding passive components within the layer structure of Printed Circuit Boards (PCBs) resulting in reduced size of card for the same functional content, possible cost savings, and yield improvement for PCB manufacture.

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 52% of the total text.

Internal Components on Printed Circuit Boards by Hybrid Circuit Technique

      Disclosed is a technique for inbedding passive components
within the layer structure of Printed Circuit Boards (PCBs) resulting
in reduced size of card for the same functional content, possible
cost savings, and yield improvement for PCB manufacture.

      Conventional Printed Circuit Boards (PCBs) are constructed from
multiple layers of insulating material 2 carrying copper traces 1 to
interconnect components 4, which are mounted on the outer surfaces of
the assembly.  Fig. 1 shows a typical construction, with copper
tracks 1 on the surfaces 2 of 3 layers of 'C-stage' material (fully
cured epoxy-glass laminates), sandwiched with two layers 3 of
'B-stage' material (partly cured laminates) which are formed and
bonded to the 'C-stage' layers at high pressure and temperature.

      'Hybrid' circuit construction uses printing techniques to make
resistors and capacitors by depositing successive patterns of
conductive 1, resistive 5, and dielectric materials 6 on the surface
of a substrate 1 - normally ceramic.  Fig. 2 shows an exploded view
of a typical hybrid circuit with a ceramic substrate 1, four layers
of printing (a,b,c,d) and some surface-mounted components 4.   These
techniques have been used commercially in combination with
conventional PCB assembly to manufacture high precision components on
the surface of otherwise conventional PCBs.  These techniques are
used on an internal plane of the PCB so that space on the outer
surfaces is saved.   Figures 3, 4...