Browse Prior Art Database

Solder Wave Surface Tension Modification Device

IP.com Disclosure Number: IPCOM000111425D
Original Publication Date: 1994-Feb-01
Included in the Prior Art Database: 2005-Mar-26
Document File: 2 page(s) / 27K

Publishing Venue

IBM

Related People

Boll, SE: AUTHOR

Abstract

In a wave soldering system if the surface tension of the molten solder to the copper surface features of the printed wiring board being soldered exceeds the cohesive force of the molten solder to retain its wave configuration, excess solder conditions result. Implementation of a surface tension modification device at the critical point of solder wave breakaway eliminates the excess solder condition.

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Solder Wave Surface Tension Modification Device

      In a wave soldering system if the surface tension of the molten
solder to the copper surface features of the printed wiring board
being soldered exceeds the cohesive force of the molten solder to
retain its wave configuration, excess solder conditions result.
Implementation of a surface tension modification device at the
critical point of solder wave breakaway eliminates the excess solder
condition.

      Polyimide finger wiper (1) mechanically fastened to the wave
solder system by wiper holder (2) wipes the bottom of the printed
wiring board (3) at the critical point of product exit from the
solder wave (4) while the solder joints (5) are still molten.  This
eliminates excess solder.