Browse Prior Art Database

Polyimide Film Solder Paste Stencil

IP.com Disclosure Number: IPCOM000111437D
Original Publication Date: 1994-Feb-01
Included in the Prior Art Database: 2005-Mar-26
Document File: 2 page(s) / 27K

Publishing Venue

IBM

Related People

Boll, SE: AUTHOR

Abstract

The application of solder to printed wiring board surface features via solder paste technology can be achieved utilizing polyimide film solder paste stencils.

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Polyimide Film Solder Paste Stencil

      The application of solder to printed wiring board surface
features via solder paste technology can be achieved utilizing
polyimide film solder paste stencils.

      In the Figure, polyimide film solder paste stencil (1) is
tooled to printed wiring board (2).  Solder paste (3) is squeegeed on
to printed wiring board surface features (4).  Perforated polyimide
film cover sheet (5) and perforated metal cover (6) are stacked on
polyimide film solder paste stencil (1).  The solder paste is
reflowed using vapor phase reflow technology.

      This process offers the following advantages over conventional
solder paste application technology:

o  Stencil cost reduction

o  Reduced stencil registration time

o  Misregistration rework is eliminated

o  Solder paste viscosity is less critical

o  Solder paste column slump is eliminated

o  Stencil paste retention on the stencil is eliminated