Browse Prior Art Database

Low Cost Anodized Aluminum Substrate with DCA for High Performance Circuitry

IP.com Disclosure Number: IPCOM000111444D
Original Publication Date: 1994-Feb-01
Included in the Prior Art Database: 2005-Mar-26
Document File: 2 page(s) / 33K

Publishing Venue

IBM

Related People

Arldt, RL: AUTHOR [+4]

Abstract

At present, advanced electronic circuitry incorporates a wide range of components, some of which generate a significant amount of heat during product operation. The resultant heat, if not removed, induces thermal stresses which consequently could cause premature product failures. There are several known techniques which remove heat from electronic components including liquid cooling, metal fins attached to chips, and thermally conductive substrates. However, these techniques are either expensive and/or impractical to be used in certain products.

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 98% of the total text.

Low Cost Anodized Aluminum Substrate with DCA for High Performance
Circuitry

      At present, advanced electronic circuitry incorporates a wide
range of components, some of which generate a significant amount of
heat during product operation.  The resultant heat, if not removed,
induces thermal stresses which consequently could cause premature
product failures.  There are several known techniques which remove
heat from electronic components including liquid cooling, metal fins
attached to chips, and thermally conductive substrates.  However,
these techniques are either expensive and/or impractical to be used
in certain products.

      The solution recommended in this disclosure is based on [1,2]
dealing with anodically grown alumina.  Instead of using thick
substrates, as described in the cited patents, this disclosure calls
for aluminum foils approximately 10 microns thick.  Each foil is
anodized and circuitized to form a 2s1p structure ( the aluminum core
is used as the power plane).  A complete panel or individual
interposer may be obtained by assembling multilayers of plane pairs
or a triplate structure with mechanical press fitting after alignment
and pinning.

      The above fabrications may serve as a single package with
direct chip attach (DCA), or it may be used as an interposer option
for wiring fanout and to accomodate C4 numbers and grid requirements
for assembly onto printed wiring boards.

References

[1]  U. S. Patent 4,898,651.

[2]  U. S...