Browse Prior Art Database

Solderability Restoration Process

IP.com Disclosure Number: IPCOM000111448D
Original Publication Date: 1994-Feb-01
Included in the Prior Art Database: 2005-Mar-26
Document File: 2 page(s) / 21K

Publishing Venue

IBM

Related People

Boll, SE: AUTHOR [+3]

Abstract

Poor solderability of electronic component leads can be restored by immersion in a flowing wave of high temperature polyoxyglycol flux.

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Solderability Restoration Process

      Poor solderability of electronic component leads can be
restored by immersion in a flowing wave of high temperature
polyoxyglycol flux.

      Leads (1) of electronic component (2) are dipped into flux wave
(3) of flowing polyoxyglycol flux (4) that is pumped through a
fountain nozzle (5).

      This process is applicable to fine pitch devices that would
result in excess solder conditions if solderability restoration was
attempted using conventional solder dipping.