Browse Prior Art Database

Water/Air Brush for Wafer Chem-Mech Polishing

IP.com Disclosure Number: IPCOM000111669D
Original Publication Date: 1994-Mar-01
Included in the Prior Art Database: 2005-Mar-26
Document File: 2 page(s) / 29K

Publishing Venue

IBM

Related People

Breiten, CP: AUTHOR

Abstract

Disclosed is a device that rids polishing pads of debris. Through this action, defects are reduced and pad life is increased. The concept is inexpensive and can be used for a variety of polishing procedures.

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 100% of the total text.

Water/Air Brush for Wafer Chem-Mech Polishing

      Disclosed is a device that rids polishing pads of debris.
Through this action, defects are reduced and pad life is increased.
The concept is inexpensive and can be used for a variety of polishing
procedures.

      In prior processing, an air brush was used to clean polishing
pads.  The addition of a continuous spray of heated water in front of
the air brush improves cleaning ability.  Heating the water prevents
a decrease in the polish rate.  The water spray loosens any embedded
particles, and the air removes water and particles from the pad.
This results in a cleaner polishing surface.

      Placement of the water/air brush behind the wafer on the
polishing pad allows for immediate pad cleaning after polish.  The
water/air brush is on for the entire polishing process.  Cleaning of
the pad is continuous.