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Browse Prior Art Database

Anti-Backside Contamination Baffle Disk for Resist and Polyimide Sprinklers

IP.com Disclosure Number: IPCOM000111717D
Original Publication Date: 1994-Mar-01
Included in the Prior Art Database: 2005-Mar-26
Document File: 2 page(s) / 41K

Publishing Venue

IBM

Related People

Lionti, M: AUTHOR [+2]

Abstract

Disclosed is a special design of the spin cup of general-purpose wafer spin coating equipment or spinners. This special design virtually eliminates back-side contamination phenomena occuring upon spin coating of a liquid material (e.g., photoresist, polyimide, ...).

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This is the abbreviated version, containing approximately 88% of the total text.

Anti-Backside Contamination Baffle Disk for Resist and Polyimide
Sprinklers

      Disclosed is a special design of the spin cup of
general-purpose wafer spin coating equipment or spinners.  This
special design virtually eliminates back-side contamination phenomena
occuring upon spin coating of a liquid material (e.g., photoresist,
polyimide, ...).

      These back-side contamination phenomena are known to be yield
detractors for IC manufacturing processes through the following
effects :

o   Exposure depth of focus problems due to particulate contamination
    under the wafer, thereby creating planarity irregularities.

o   General contamination and defect density problems.

      The present disclosure concerns the design of the zone
immediately below the wafer in the spinner.  This zone is usually
called the "splash ring" and is aimed at guiding the surplus material
to the waste and at guiding the air flow to the exhaust of the
spinner, respectively (Fig. 1(a)).

      The present disclosure concerns the upper plane of the "splash
ring", that is, the plane immediately below the wafer back-side in
the spin-coating assembly.  The splash ring is designed in such a way
that the upper-plane countour line is a circle whose diameter is the
wafer diameter.  It is possible to adjust existing parts to this new
design constraint by extending the upper plane to the wafer diameter,
as shown in Fig. 1(b).

      The use of this design virtually eliminates...