Browse Prior Art Database

Use of Diamond Particles for High Thermal Dissipation in Flip Chip MCMs

IP.com Disclosure Number: IPCOM000111766D
Original Publication Date: 1994-Mar-01
Included in the Prior Art Database: 2005-Mar-26
Document File: 2 page(s) / 28K

Publishing Venue

IBM

Related People

Bhattacharya, S: AUTHOR

Abstract

Thermal grease has been used extensively in recent years to remove heat from flip chip single and multiple chip modules. The performance of the thermal grease can be significantly enhanced by the use of synthetic powdered diamond as the primary heat-conducting material since the heat conductivity of diamond is more than an order of magnitude greater than the material used in the thermal grease today.

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Use of Diamond Particles for High Thermal Dissipation in Flip Chip
MCMs

      Thermal grease has been used extensively in recent years to
remove heat from flip chip single and multiple chip modules.  The
performance of the thermal grease can be significantly enhanced by
the use of synthetic powdered diamond as the primary heat-conducting
material since the heat conductivity of diamond is more than an order
of magnitude greater than the material used in the thermal grease
today.

      In the Figure, the heat generated in the chip 1 is carried
mainly through the thermal grease 2 into the aluminum cap 3 which is
subsequently dissipated into the circulating water 4.  A minor
portion of the heat is carried through the solder balls 5 into the
substrate 6.  Thermal grease containing synthetic diamond particles
will lead to significant improvements in thermal dissipation
capability of the package.  This can be further improved by immersing
the solder balls 5 in a diamond-containing thermal grease.