Browse Prior Art Database

Split Card Cage for High Performance Electronic Packaging

IP.com Disclosure Number: IPCOM000111815D
Original Publication Date: 1994-Apr-01
Included in the Prior Art Database: 2005-Mar-26
Document File: 2 page(s) / 46K

Publishing Venue

IBM

Related People

Babcock, RF: AUTHOR [+4]

Abstract

Described is a method for packaging memory cards and Multi-Chip Module (MCM) processor devices in close proximity for high performance processing, while allowing efficient cooling and easy service access. By splitting the card cage into two sections, space is provided for mounting the MCMs between the cages.

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Split Card Cage for High Performance Electronic Packaging

      Described is a method for packaging memory cards and Multi-Chip
Module (MCM) processor devices in close proximity for high
performance processing, while allowing efficient cooling and easy
service access.  By splitting the card cage into two sections, space
is provided for mounting the MCMs between the cages.

      The Figure shows the split cage with the MCMs mounted in the
center.  The cages allow memory cards to be plugged into the
backplane in close proximity to the processor modules for short
system clock cycles and increased system performance.  It also allows
bottom-to-top air flow for cooling of both processor and memory,
allowing air-moving devices to be located together, at the bottom of
the card cage.  Memory and processor units can be accessed easily
from the front of the system for quick service.  It also provides
adaptability for various-width processor units by moving the
split-cage sections closer or farther apart.

      With the processor-memory bus going off to each side of the
processors, there is less wiring density in the backpanel than if it
all went to one side.  Therefore, there are less planes in the
backpanel and fewer lines per channel, which reduces backpanel
manufacturing costs and improves process yields.