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Novel Cleaning Procedure for Non-Attached Lubricant on Thin Film Magnetic Disk

IP.com Disclosure Number: IPCOM000111845D
Original Publication Date: 1994-Apr-01
Included in the Prior Art Database: 2005-Mar-26
Document File: 2 page(s) / 38K

Publishing Venue

IBM

Related People

Clark, TC: AUTHOR [+4]

Abstract

Disclosed is an ultrasonic cleaning procedure following the attachment or "bonding" of a lubricant to a disk surface, which permits removal of the non-attached material in a more efficient and reproducible manner than a conventional dipping process.

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 82% of the total text.

Novel Cleaning Procedure for Non-Attached Lubricant on Thin Film
Magnetic Disk

      Disclosed is an ultrasonic cleaning procedure following the
attachment or "bonding" of a lubricant to a disk surface, which
permits removal of the non-attached material in a more efficient and
reproducible manner than a conventional dipping process.

      One method used to improve durability and performance of a
thin-film magnetic disk involves applying a thin film of fluorinated
lubricant to the disk surface.  This film is usually applied by
dipping the disk in a dilute solution of the lubricant in an
appropriate solvent.  To avoid spin-off and reduce stiction, the
lubricant is firmly bonded to the disk surface using a procedure such
as ultraviolet, plasma, electron beam, or thermal treatment after
coating.  Excess lubricant is removed by washing the disk with a
solvent.

      The amount of lubricant removed depends on a number of process
conditions such as dipping time, temperature, surface composition,
surface roughness and initial film thickness.  In known processes,
some of the non-attached lubricant remains on the disk surface even
after prolonged dipping.  This residue may alter disk performance,
particularly in a duplex lubricant system where an additional free
lubricant layer is deposited on top of the bonded layer.

      To implement the present invention, the disk is first immersed
in a common organic solvent after bonding.  Examples of such solvents
inc...