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Device for Placement and Bonding Out Leads of Tape Automated Bonding Packages

IP.com Disclosure Number: IPCOM000111868D
Original Publication Date: 1994-Apr-01
Included in the Prior Art Database: 2005-Mar-26
Document File: 2 page(s) / 69K

Publishing Venue

IBM

Related People

Austin, DV: AUTHOR [+4]

Abstract

Disclosed is a device for picking, placing and attaching a Tape Automated Bonding package using a single, compact end-of-arm robot tool.

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 64% of the total text.

Device for Placement and Bonding Out Leads of Tape Automated Bonding
Packages

      Disclosed is a device for picking, placing and attaching a Tape
Automated Bonding package using a single, compact end-of-arm robot
tool.

      The device is shown in Fig. 1.  It uses four fiber optic
sensors as described in [*], two for sensing the location of the
package when it is picked up from its feed station and two for
sensing the location of the boding site on the circuit board.  In
addition, it has vacuum ports for picking up the package and build in
hot knife thermodes for solder bonding the package to the circuit
board.  The fiber optic sensors have the capability to sense the
location of fiducials on both the package and the circuit board by
giving a separate X and Y error signal proportional to the horizontal
distance from the fiducial.  When the sensor is directly above a
fiducial, a zero X and Y error signal is given by the sensor.

      The package contains two fiducials in the form of a round dot
and two windows or holes through which sensors view similar fiducials
on a circuit board.  Two sensors on the bonding device are located so
that when the fiducials on the package are placed at these sensor
locations the outer leads of the package are in the proper
relationship to the hot knife thermode blades.  This relationship is
shown in Fig. 2.  The robot to which this device is attached can
manipulate the bonding device until the best alignment is achieved
...