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Browse Prior Art Database

High Temperature Solder Removal/Rework Process

IP.com Disclosure Number: IPCOM000112002D
Original Publication Date: 1994-Apr-01
Included in the Prior Art Database: 2005-Mar-26
Document File: 2 page(s) / 84K

Publishing Venue

IBM

Related People

Kelly, HL: AUTHOR [+4]

Abstract

Disclosed is a systematic approach for removing solder sealbands that reflow at unusually high temperatures, during the rework of electronic/semiconductor packages. This new technique is suggested as an alternative to traditional "solder sucker" devices in applications where the prior art proves to be inadequate in the areas of heat output capacity, vacuum force and/or stability over time, solder volume accumulation capacity, or temperature/process control capabilities. It has been applied by the authors to remove ceramic lids from packages for rework of the circuitry inside, but is applicable to any type of similar solder rework.

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High Temperature Solder Removal/Rework Process

      Disclosed is a systematic approach for removing solder
sealbands that reflow at unusually high temperatures, during the
rework of electronic/semiconductor packages.  This new technique is
suggested as an alternative to traditional "solder sucker" devices in
applications where the prior art proves to be inadequate in the areas
of heat output capacity, vacuum force and/or stability over time,
solder volume accumulation capacity, or temperature/process control
capabilities.  It has been applied by the authors to remove ceramic
lids from packages for rework of the circuitry inside, but is
applicable to any type of similar solder rework.

      This new equipment and process were developed to deal with the
characteristics of an IBM module product that uses tin/antimony
solder.  Because this solder reflows at a temperature 57 degrees
higher than that of standard lead/tin solder, combined with the fact
that it is a heavier sealband, it is challenging to work with.  The
product is also somewhat sensitive to heat, so it is not possible to
simply infuse massive quantities of heat through the substrate or
from the immediate environment, because the product would be
irreparably damaged.  For this reason it was also desired to have a
control system that allows monitoring of the temperatures involved
(i.e., product, tool probe, atmosphere, etc.) on a real-time basis.

      These concerns were resolved by designing an enhanced
solder-removal system that is more than just a "solder sucker".
Basically, the new system is comprised of 4 major components:  a
unique and powerful vacuum probe device; a reservoir enhanced vacuum
system; a control system for monitoring and regulating the module
temperature, probe temperature, and vacuum; and the surrounding
chamber which includ...