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Browse Prior Art Database

Formable Surface Mount Feature for Flexible Circuitry

IP.com Disclosure Number: IPCOM000112058D
Original Publication Date: 1994-Apr-01
Included in the Prior Art Database: 2005-Mar-26
Document File: 4 page(s) / 78K

Publishing Venue

IBM

Related People

Campbell, JS: AUTHOR [+3]

Abstract

This invention relates to SMT mounting of flexible circuitry to cards using solder. It is common practice to form a single row of flex leads on a flexible circuit prior to soldering such a flex to a card. This forming provides a means to stand the flex off and away from the card for easy cleaning of flux after soldering; and to overcome the thickness of various layers within the flex, allowing the flex leads to readily contact designated pads on the card prior to soldering. Such single row attachment methods are presently limited to about 60 I/O per linear inch, due to manufacturing alignment capabilities.

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Formable Surface

Mount

Feature

for Flexible Circuitry

      This invention relates to SMT mounting of flexible circuitry to
cards using solder.  It is common practice to form a single row of
flex leads on a flexible circuit prior to soldering such a flex to a
card.  This forming provides a means to stand the flex off and away
from the card for easy cleaning of flux after soldering; and to
overcome the thickness of various layers within the flex, allowing
the flex leads to readily contact designated pads on the card prior
to soldering.  Such single row attachment methods are presently
limited to about 60 I/O per linear inch, due to manufacturing
alignment capabilities.

      The disclosed invention allows for flex to be attached in
multiple rows to a card, with the linear connection density only
being limited by the manufacturing limits of the flex itself, 250+
I/O per inch.

      The invention can be described in summary as a flexible circuit
with unique SMT windows which allow individual flex leads to be
formed and soldered to a card.

      The existing method for SMT attachment of flex to a card can be
seen in Fig. 1.  A flex (2) with uninsulated formed leads (4) is
soldered in a single row to card pads (3) on card (1).

      The disclosed invention is shown in Fig. 2.  Flex (2) can be
SMT mounted to card (1) by soldering formed leads (4) to card pads
(3), through window openings (11).  The formed leads (4) and card
pads (3) may be configured...