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Browse Prior Art Database

Infrared Reflector for Crack Prevention at Card Assembly

IP.com Disclosure Number: IPCOM000112069D
Original Publication Date: 1994-Apr-01
Included in the Prior Art Database: 2005-Mar-26
Document File: 2 page(s) / 27K

Publishing Venue

IBM

Related People

Dalbo, JM: AUTHOR [+2]

Abstract

This article describes an infrared (IR) reflector for shielding Plastic Flatpack (PFP) products during the baking step of the manufacturing process.

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 100% of the total text.

Infrared Reflector for Crack Prevention at Card Assembly

      This article describes an infrared (IR) reflector for shielding
Plastic Flatpack (PFP) products during the baking step of the
manufacturing process.

      The Figure shows a module 10 mounted to a substrate 12 and the
IR reflector 14 for shielding the module 10 during the baking
process.  The IR reflector has a standoff height that maintains an
insulating air space between the top surface of the module and bottom
surface of the reflector.  The airspace prevents heat conduction.
Preferably, the reflector is fabricated from metal.  The top surface
of the reflector is a mirrored surface.  Polished aluminum, gold, and
chrome surfaces have shown significant temperature reductions.  This
IR reflector can be used for a broad spectrum of SMT components to
prevent cracking when using an IR oven for card assembly.