Browse Prior Art Database

Peeling Tape Connector

IP.com Disclosure Number: IPCOM000112134D
Original Publication Date: 1994-Apr-01
Included in the Prior Art Database: 2005-Mar-26
Document File: 4 page(s) / 87K

Publishing Venue

IBM

Related People

Nishida, H: AUTHOR [+3]

Abstract

Disclosed is (I) construction of "Peeling Tape Connector (PTC)" and (II) its application as a part of high density SMT (Surface Mount Technology) connector system on PCB (Printed Circuit Board). Raw part of PTC consists of dielectric layer, contact bumps (on the front side) and bonding bumps (on the back side). These bonding bumps are bonded with solder or electrically conductive adhesive to the PCB pads and the dielectric layer is peeled off from the PCB. Bumps are accommodated as the contact bumps for connector system on the PCB.

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Peeling Tape Connector

      Disclosed is (I) construction of "Peeling Tape Connector (PTC)"
and (II) its application as a part of high density SMT (Surface Mount
Technology) connector system on PCB (Printed Circuit Board).  Raw
part of PTC consists of dielectric layer, contact bumps (on the front
side) and bonding bumps (on the back side).  These bonding bumps are
bonded with solder or electrically conductive adhesive to the PCB
pads and the dielectric layer is peeled off from the PCB.  Bumps are
accommodated as the contact bumps for connector system on the PCB.

I. Construction of Device

      Fig. 1 shows a typical construction of this device.  Contact
bumps (2), which are covered with contact metal (such as gold or
palladium), are located on the front side surface of the dielectric
(1) (such as polyimide, polyester or epoxy/grass).  Bonding pads (3)
are located on the back side surface of the dielectric.  Dielectric
layer has alignment holes (4) in order to allow the accurate
alignment of PTC to the PCB.  Fig. 2 shows the crosssection of
contact bump (2).

Relationship of the bump dimensions are:   d1 =<  d2  =<  d3
so that the dielectric layer can be removed after PTC bonding.

II.  Application

      Fig. 3 shows a typical application as a part of high density
SMT connector system on PCB.  Bonding pads of PTC are soldered or
electrically bonded to the PCB-pads.  Solder or bonding adhesive is
isolated by the dielectric layer(1) so that the infl...