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Integrated Assembly and Repair Thermode for Soldering

IP.com Disclosure Number: IPCOM000112139D
Original Publication Date: 1994-Apr-01
Included in the Prior Art Database: 2005-Mar-26
Document File: 2 page(s) / 52K

Publishing Venue

IBM

Related People

Hoffmeyer, MK: AUTHOR [+3]

Abstract

A thermode design is disclosed.

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 65% of the total text.

Integrated Assembly and Repair Thermode for Soldering

      A thermode design is disclosed.

      A thermode was designed to provide for a more robust hot bar
attach soldering process through the incorporation of a vacuum system
within the thermode which provides for simultaneous assembly, bridge
removal, and solder levelling during solder reflow and component
attach operations.  The thermode accommodates a wide range of
non-uniformities in solder deposition characteristics.  As shown in
the figure, the thermode design incorporates a vacuum system
including:

1.  Thermode

2.  Embedded Vacuum Line

3.  Vacuum Orifices

4.  Vacuum Chamber Seal

5.  Vacuum Chamber

      The thermode 1 is comprised of two sections.  Positive and
negative terminals are made of brass and are welded to a folded
stainless steel sheath which connects the terminals and provides for
resistive heating.  The folded stainless steel section of the
thermode 1 is impregnated with a suitable sealant material 4 which is
used to fixture the embedded vacuum line 2 and create the vacuum
chamber 5.  A series of orifices 3 along the bottom of the folded
stainless steel thermode section provide for  vacuum inlets in direct
proximity to lead spacings in the component to carrier solder
assembly area.

      Upon contact of the thermode to a part, resistance heating of
the thermode is provided from a power source.  After heating thru a
temperature range sufficient to completely reflow the sol...