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Fine Solder Joint Inspection Method with 2-Fixed-X-Ray Tube

IP.com Disclosure Number: IPCOM000112149D
Original Publication Date: 1994-Apr-01
Included in the Prior Art Database: 2005-Mar-26
Document File: 2 page(s) / 41K

Publishing Venue

IBM

Related People

Shiota, Y: AUTHOR [+2]

Abstract

This article describes a fine solder joint inspection method and equipment which has two fixed micro focus X-ray tubes, one is vertical and another is angled. It works for the inspection of micro soldering joints for Flip Chip Bonding which soldering joints are hidden underneath Chip C4 bump. (C4: Controlled Collapse Chip Contact/Connection)

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Fine Solder Joint Inspection Method with 2-Fixed-X-Ray Tube

      This article describes a fine solder joint inspection method
and equipment which has two fixed micro focus X-ray tubes, one is
vertical and another is angled.  It works for the inspection of micro
soldering joints for Flip Chip Bonding which soldering joints are
hidden underneath Chip C4 bump.  (C4: Controlled Collapse Chip
Contact/Connection)

      Fig. 1 shows the configuration and example of inspection.
Electrical card assembly with Flip Chip Bonding (1) is located on a
X-Y-Theta table (2) between 2 X-ray tubes (3) and detectors (4).
X-ray images are displayed on TV screens (5) through CCD cameras (6).
Operator inspects 2 X-ray-images on 2 TV screens.

      Fig. 2 shows the defect example of Flip Chip Bonding.  The
detection of poor wetting needs both vertical and angled X-ray
images.

      This method is not limited to the inspection of Flip Chip
Bonding, and it is also applicable for SMT (Surface Mounting Type)
fine pitch soldering, especially mirror-imaged soldering joints on
both sides of electrical assembly card.