Browse Prior Art Database

Method for Measuring a Solder Bump using Local Image focusing Evaluation

IP.com Disclosure Number: IPCOM000112159D
Original Publication Date: 1994-Apr-01
Included in the Prior Art Database: 2005-Mar-26
Document File: 2 page(s) / 45K

Publishing Venue

IBM

Related People

Saitoh, F: AUTHOR

Abstract

Disclosed is a system for measuring the three-dimensional Figure of a solder bump on the bottom of a device chip using image processing. After the image from the top view including a solder bump is separated to some local areas, focusing rate is evaluated in each area. The three-dimensional figure is constructed by focusing position in each local area.

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Method for Measuring a Solder Bump using Local Image focusing Evaluation

      Disclosed is a system for measuring the three-dimensional
Figure of a solder bump on the bottom of a device chip using image
processing.  After the image from the top view including a solder
bump is separated to some local areas, focusing rate  is evaluated in
each area.  The three-dimensional figure is constructed by focusing
position in each local area.

      The Figure shows the system configuration.  The image including
a solder bump (1) on the bottom of a device chip (2) is shot by the
TV camera (3) built on the microscope (4) and processed by the image
processor (5).  The device chip is set on the Z-stage (6).  The image
is separated to some rectangular area.  The focus in each area is
evaluated by image processing algorithm.  The operation for measuring
the three-dimensional Figure of the solder bump is executed as
following steps.

1.  The position of the Z-stage is adjusted to focus on the bottom of
    the device chip.

2.  The focus is evaluated in each rectangular area.

3.  Z-stage is moved to the lower direction slightly.

4.  Steps 1.  and 2.  are repeated as far as the moving distance of
    the Z-stage is reached to the maximum height of the solder bump.

5.  The position of Z-stage meaning the just focus in each
    rectangular area has equivalent the height of the local surface
    of the solder bump.

6.  The three-dimensional figure is construct...