Browse Prior Art Database

Leadless Flip-Chip Attach Flatpack

IP.com Disclosure Number: IPCOM000112160D
Original Publication Date: 1994-Apr-01
Included in the Prior Art Database: 2005-Mar-26
Document File: 2 page(s) / 36K

Publishing Venue

IBM

Related People

Iguchi, Y: AUTHOR [+2]

Abstract

Disclosed is a leadless package for semiconductor chip. Surface Laminer Circuit (SLC) built on a metal core base is used for the connection between the chip C4 pads and the land pattern of a circuit board. The outer pads of SLC substrate are used for the lead connection after substrate edge forming. This enables the leadless fine pitch connection.

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Leadless Flip-Chip Attach Flatpack

      Disclosed is a leadless package for semiconductor chip.
Surface Laminer Circuit (SLC) built on a metal core base is used for
the connection between the chip C4 pads and the land pattern of a
circuit board.  The outer pads of SLC substrate are used for the lead
connection after substrate edge forming.  This enables the leadless
fine pitch connection.

      Fig. 1 shows the configuration of leadless package.  A silicon
chip 10 is attached on a metal core SLC substrate 20 by
Flip-Chip-Attach (FCA) process.  In this package, the SLC substrate
has part of outer lead 30 and the outer leads are formed by substrate
edge forming by press.

      Fig. 2 shows a cross sectional image of this package.  As shown
in this Figure, the outer pads 40, formed on the outer leads, are
used for a solder connection to a circuit board 50.