Browse Prior Art Database

Uniform Direct Plating Method onto Insulator

IP.com Disclosure Number: IPCOM000112210D
Original Publication Date: 1994-Apr-01
Included in the Prior Art Database: 2005-Mar-26
Document File: 2 page(s) / 38K

Publishing Venue

IBM

Related People

Hayashi, S: AUTHOR [+2]

Abstract

Disclosed is a method to enhance an uniformity of the direct electroplated deposit distribution over an organic insulator by a conductor net as the coming bar of electron which is originally designed under the organic insulator. This conductor net lies in the inactive area of the substrate and covers cross the active area, which is exposed with several manufacturing aspects, e.g., beveling, drilling, photo expose and others. This conductor net can improve an uniformity of the electric field over the substrate at the initial stage of the electroplating under strict condition caused by very thin conductive deposit. In addition, this conductor net enables to apply high current to the electroplating.

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Uniform Direct Plating Method onto Insulator

      Disclosed is a method to enhance an uniformity of the direct
electroplated deposit distribution over an organic insulator by a
conductor net as the coming bar of electron which is originally
designed under the organic insulator.  This conductor net lies in the
inactive area of the substrate and covers cross the active area,
which is exposed with several manufacturing aspects, e.g., beveling,
drilling, photo expose and others.  This conductor net can improve an
uniformity of the electric field over the substrate at the initial
stage of the electroplating under strict condition caused by very
thin conductive deposit.  In addition, this conductor net enables to
apply high current to the electroplating.

      These are two examples, one is designed with the conductor nets
underneath the organic insulator and the ather allows the drilled
holes to be the conductor net from back side layer.  Breakdowns of
the steps, how to make the conductor net, are mentioned hereinafter.

   Example 1   Make the conductor nets in the inactive area.
               Apply the organic insulate material.
               Remove the organic insulator on the conductor net.
               Electrolessplate to create the thin conductive
deposit.
               Electroplating.

   Example 2   Apply the organic insulate material.
               Drill holes in the inactive...