Browse Prior Art Database

Cooling Thermal Cooled Module Chips with Thermally "Tuned" Pistons

IP.com Disclosure Number: IPCOM000112260D
Original Publication Date: 1994-Apr-01
Included in the Prior Art Database: 2005-Mar-27
Document File: 2 page(s) / 22K

Publishing Venue

IBM

Related People

Hegi, RG: AUTHOR

Abstract

Disclosed is a silicon chip cooling device (piston) that is "tuned" to individual chip cooling requirements.

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 100% of the total text.

Cooling Thermal Cooled Module Chips with Thermally "Tuned" Pistons

      Disclosed is a silicon chip cooling device (piston) that is
"tuned" to individual chip cooling requirements.

      Made of copper or aluminum, the piston side wall is slotted one
or more times raising or lowering its cooling efficiency.

      Slotting also benefits piston selection/identification and
prevents hydralic/pneumatic lock within the piston retaining cavity.
The slot may be straight or spiral.

      Slot design can be square, rectangular or V-groove depending on
manufacturing technique and burr elimination requirements.

      All slotting need not break through the piston crown where
total chip to crown intimacy is desirable (Figure).