Browse Prior Art Database

"Z" Action Montion Eliminator for Handling Semiconductors

IP.com Disclosure Number: IPCOM000112285D
Original Publication Date: 1994-Apr-01
Included in the Prior Art Database: 2005-Mar-27
Document File: 2 page(s) / 78K

Publishing Venue

IBM

Related People

Elenius, PM: AUTHOR [+2]

Abstract

Disclosed is a method which enhances the safe handling and transportation of semiconductor products such as computer chips. It consists of a molded thin-wall plastic pad that is conformal to the chip carrier to eliminate the vertical motion, called "Z" motion. "Z" motion results from excess clearance created by normal cover manufacturing methods. When two are used on each side of the chip, they will form a controlled "soft" clamping action on the chip to prevent deformation or damage to the solder balls or chip material when subjected to handling and transportation.

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This is the abbreviated version, containing approximately 52% of the total text.

"Z" Action Montion Eliminator for Handling Semiconductors

      Disclosed is a method which enhances the safe handling and
transportation of semiconductor products such as computer chips.  It
consists of a molded thin-wall plastic pad that is conformal to the
chip carrier to eliminate the vertical motion, called "Z" motion.
"Z" motion results from excess clearance created by normal cover
manufacturing methods.  When two are used on each side of the chip,
they will form a controlled "soft" clamping action on the chip to
prevent deformation or damage to the solder balls or chip material
when subjected to handling and transportation.

      The ZAME method relates to the transportation and safe handling
of chips and other fragile items.  This is accomplished by providing
a controlled "soft" contact to the top and bottom chip surfaces to
prevent chip damage from movement within their carrier pockets.
Since this method provides a controlled "soft" clamping action on the
device, it will also prevent lateral movement ("X" and "Y") of the
device.

      The main purpose of this method is to provide precise
individual clamping of the chips to minimize or eliminate "Z"
movement within their carrier pockets.  This controlled clamping
action will prevent damage to the solder balls of C4's (Controlled
Collapsible Chip Connections) during handling and transportation by
minimizing or eliminating the "Z" movement and resulting impact
forces on one of the devices between the covers of the pockets.

      This method will also minimize or eliminate the particle
generation caused by chip movement against the sidewalls of their
carrier pockets.  This feature is also provided by the "soft"
clampi...