Browse Prior Art Database

Adhesion Promotor for Resist on Sputtered Permalloy

IP.com Disclosure Number: IPCOM000112346D
Original Publication Date: 1994-Apr-01
Included in the Prior Art Database: 2005-Mar-27
Document File: 2 page(s) / 24K

Publishing Venue

IBM

Related People

Baratte, H: AUTHOR [+8]

Abstract

This article describes an improved adhesion of organic photoresiston sputtered permalloy.

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 100% of the total text.

Adhesion Promotor for Resist on Sputtered Permalloy

      This article describes an improved adhesion of organic
photoresiston sputtered permalloy.

      When photoresist is spun on sputtered permalloy during the
fabrication of magnetic heads, bad adhesion of the resist on the
permalloy films is often observed.

      To improve the adhesion, the permalloy surface is activated
(conditioned) with carbon.

      For this purpose, the wafers are dipped in developer before
spinning on the photoresist.  This is a simple and fast solution and
avoids a tedious evaluation of the wafers needed for rework.

      The Figure shows the dependence of the wetting angle (water) on
time for conditioned and not conditioned wafers.