Browse Prior Art Database

Copper Blocks for Chip Site Dress

IP.com Disclosure Number: IPCOM000112359D
Original Publication Date: 1994-May-01
Included in the Prior Art Database: 2005-Mar-27
Document File: 2 page(s) / 27K

Publishing Venue

IBM

Related People

Bowne, CP: AUTHOR [+2]

Abstract

Disclosed is a process for dressing chip sites with a copper block having cone shaped protrusions to be aligned and heating using an Infrared Radiation source.

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Copper Blocks for Chip Site Dress

      Disclosed is a process for dressing chip sites with a copper
block having cone shaped protrusions to be aligned and heating using
an Infrared Radiation source.

      In the Figure, the solder on the microsockets on top of the
biased substrates is dressed using cone shaped copper blocks.  The
cone shaped protrusion of a specified dimension on the underside of
the copper block is aligned and placed on top of the microsockets
with the use of any optics system.  The cone shaped protrusions will
allow for enhanced abilities for a much greater requirements imposed
on the alignment due to the microsocket sizes and obstructions on the
substrates.  Once the block is in place, an infrared heat source is
used to raise the temperature of the solder up to liquidus.  Once at
the liquidus state the solder on the microsockets will be drawn up
into the copper block and positioned into place while wicking of the
solder takes place.