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Low-Cost and High-Temperature Stable Adhesion Promoter for Polymer-to-Copper Interface: Organic Compounds Containing Triazole or Imidazole Functionality

IP.com Disclosure Number: IPCOM000112429D
Original Publication Date: 1994-May-01
Included in the Prior Art Database: 2005-Mar-27
Document File: 2 page(s) / 42K

Publishing Venue

IBM

Related People

-W Lee, K: AUTHOR [+4]

Abstract

Disclosed is a method for improving adhesion of polymer to copper without a metal adhesive layer.

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 73% of the total text.

Low-Cost and High-Temperature Stable Adhesion Promoter for Polymer-to-Copper
Interface:  Organic Compounds Containing Triazole or Imidazole Functionality

      Disclosed is a method for improving adhesion of polymer to
copper without a metal adhesive layer.

      Polyimides are widely used in the electronic applications.
Polyimides derived from polyamic ester instead of polyamic acid have
been employed in the current microelectronic applications.  However,
adhesion of polyamic ester to copper with conventional adhesion
promoters is poor.  The process with metal adhesion promoters such as
chromium or CoP should be selective and it is relatively expensive.
Ultra low cost and high temperature stable adhesion promoters are
important to the low cost packaging technology.

      If a polyamic ester is employed as a polyimide precursor in
both a wiring level and a stud level, copper oxide precipitates are
not formed in the cured polyimide.  Thus a diffusion barrier layer
between PI and Cu is not required.  A good adhesion promoter for the
PI-to-Cu adhesion can substitute for the conventional Cu capping
material.

      Triazole and imidazole functional groups are known to form a
complex with copper.  Thus adhesion of these compounds to the copper
substrate is good.  Incorporation of heterocyclic functionality
enhances thermal stability.  The present invention discloses an
extremely simple and low cost polyimide-to-copper adhesion promotion
with a monomeric...